| Important Dates (2018) | ||
| January 21, 24:00 AoE | Paper Submission Deadline | |
| January 15, 24:00 AoE | Abstract Submission Deadline |
|
| February 19 | Notification | |
March 23 |
Camera-ready | |
The technical papers track will focus on significant, novel and emerging solutions for mobile application software engineering. These should be well-motivated, carefully compared, and contrasted with significant related research. Papers should include methodology, implementation, results, and discussion as appropriate. Solutions are expected to be rigorously evaluated.
Areas of contribution may include technological advancements, architectural approaches, advancements in design and implementation methods, testing approaches, user interfaces and HCI, business and organizational issues, and empirical studies. We solicit contributions of full papers (up to 10 pages, with up to 2 additional pages only for references), and short papers (up to 4 pages, with 1 additional page only for references). Full papers are expected to make a significant new research or practice contribution. Short papers are expected to present an interesting, well-developed contribution of more modest proportions. Papers must not have been previously published or be under consideration elsewhere for publication. We solicit contributions from both academia and industry.
Formatting and Submission Instructions
All submissions must conform to the ACM formatting and submission instructions and must not exceed 10 pages for the main text, inclusive of figures, tables, appendices, etc. Two more pages containing only references are permitted. All submissions must be in PDF. The page limit is strict, and it will not be possible to purchase additional pages at any point in the process (including after the paper is accepted).
For MS Word users: Use the ACM_SigConf.docx template following the instructions from the NEW ACM formatting guidelines (https://www.acm.org/publications/proceedings-template).
For LaTex users: Use the NEW ACM formatting guidelines (https://www.acm.org/publications/proceedings-template). Upon unzipping the zip file, run ‘make all’. This will produce the acmart.cls file. You should use the conference format described in sample-sigconf.tex to format your paper. You are recommended to use the ‘review’ option (\documentclass[sigconf,review]{acmart}) which will add line numbers, thereby allowing referees to refer to specific lines in their comments, but we do not enforce the use of the ‘review’ option (that is, we will not desk reject papers for failing to use this option).
Accepted papers will be published in the conference electronic proceedings and in both the ACM Digital Library and IEEE Digital Library.
Submit via Easy Chair (both short and long papers):
https://easychair.org/conferences/?conf=mobilesoft2018
Proceedings
At least one author of an accepted contribution is required to register, present the work, and participate during the discussions at the forum. Accepted papers will be published in the conference electronic proceedings and in both the ACM Digital Library and IEEE Digital Library.
PC co-chairs: Grace A. Lewis and Itai Segall
Additional Information
For additional information, clarification, or answers to questions please contact the Program Committee Co-chairs (Grace A. Lewis and Itai Segall) at tech@mobilesoftconf.org.
Program Committee Members
| PC Member name | Affiliation, Country |
|---|---|
| Mohamed Abdelrazek | Deakin University, Australia |
| Marco Autili | University of L’aquila, Italy |
| Matthias Book | University of Iceland, Iceland |
| Marco Brambilla | Politecnico di Milano, Italy |
| Tiziana Catarci | Sapienza University of Rome, Italy |
| Paolina Centonze | Iona College |
| Schahram Dustdar | TU Wien |
| Yishai A. Feldman | IBM Research – Haifa |
| Lori Flynn | CERT, USA |
| Stephan Krusche | Technische Universität München, Germany |
| Yves Le Traon | University of Luxembourg, Luxembourg |
| Ivano Malavolta | Vrije Universiteit Amsterdam, Netherlands |
| Sam Malek | University of California – Irvine, USA |
| Henry Muccini | University of L’Aquila, Italy |
| Angela Nicoara | Intel Labs, USA |
| Sethu Ramesh | General Motors R&D, USA |
| Abhik Roychoudhary | National University of Singapore, Singapore |
| Antonino Sabetta | SAP Labs, France |
| Norsaremah Salleh | International Islamic University Malaysia, Malaysia |
| Lionel Seinturier | University Lille 1 – Inria, France |
| Emad Shihab | Concordia University, Canada |
| Alberto Sillitti | Innopolis University, Russia |
| Wolfgang Slany | Graz University of Technology, Austria |
| Alin Stefanescu | University of Bucharest, Romania |
| Weibin Sun | Google, USA |
| Antero Taivalsaari | Nokia Research Center, Finland |
| Shingo Takada | Keio University, Japan |
| Shmuel Tyszberowicz | The Academic College of Tel-Aviv Yaffo, Israel |
| Komminist Weldermariam | IBM Africa, Kenya |
| Abram Hindle | University of Alberta, Canada |
| Borje Karlsson | Microsoft Research Asia, China |
| Federica Sarro | University College London, UK |